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Your location:  Home  -> PRODUCT  ->  Semicon Packaging Cleaning Machine
2022
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05
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Semicon Packaging Cleaning Machine SC810
SC810 is chip semiconductor packaging in line cleaning machine. Use to clean flux and other contamination on Chip after soldering during chip packaging process. SC810 is design to in line clean lead frame, IGBT, IPM, IC modules chips.
SC810 is chip semiconductor packaging in line cleaning machine. Use to clean flux and other contamination on Chip after soldering during chip packaging process. SC810 is design to in line clean lead frame, IGBT, IPM, IC modules chips.
2022
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05
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13
Semicon Packaging Clenaing Machine SC820
SC820 is a semiconductor packaging in line cleaning system. Use to clean flux and other contamination on Chips after soldering during chip packaging process. SC820 is design to clean lead frame, IGBT, IPM, BGA,CSP chips.
SC820 is a semiconductor packaging in line cleaning system. Use to clean flux and other contamination on Chips after soldering during chip packaging process. SC820 is design to clean lead frame, IGBT, IPM, BGA,CSP chips.
2022
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05
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13
Semicon Packaging Water Cleaning Machine SC610
SC610 is a semiconductor packaging in line cleaning machine. SC610 is used to clean water-based flux and other contamination on Lead frame, FCBGA, FCCSP... after ball placement and soldering process during chip packaging.
SC610 is a semiconductor packaging in line cleaning machine. SC610 is used to clean water-based flux and other contamination on Lead frame, FCBGA, FCCSP... after ball placement and soldering process during chip packaging.
2022
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05
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13
Semicon Packaging Water Cleaning Machine SC620
SC620 is a semiconductor packaging in line deflux machine. SC620 is used to clean water-based flux and other contamination on Lead frame, FCBGA, FCCSP... after ball placement and soldering process during chip packaging.
SC620 is a semiconductor packaging in line deflux machine. SC620 is used to clean water-based flux and other contamination on Lead frame, FCBGA, FCCSP... after ball placement and soldering process during chip packaging.
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